FPT Analysis Technologies (FAT)

As a member of FPT Corporation, FPT Analysis Technologies provides semiconductor testing and packaging services for the global market. FAT delivers a comprehensive One-Stop Production Test solution, covering ATE development, final test, burn-in, reliability qualification, and advanced packaging support.

Leveraging fully automated, high-throughput testing lines capable of up to 600,000 units per hour, together with strong engineering expertise in Power, Analog, and Sensor ICs, FAT helps semiconductor companies overcome production bottlenecks, accelerate time-to-market, and improve manufacturing yield. Positioned as a reliable testing and packaging partner, FAT supports global chipmakers in delivering high-quality semiconductor products to worldwide markets.

Contact Us

Vision

To be a world-class semiconductor testing partner, enabling faster innovation and reliable scaling for global chipmakers through advanced automation and engineering excellence.

Mission

To deliver end-to-end, high-throughput semiconductor testing solutions that shorten time-to-market, optimize yield, and ensure long-term product reliability from R&D to mass production.

Why Choose FAT as Our
Reliable Partner?

One-Stop Testing Partner

End-to-end services covering ATE development, production testing, burn-in, and reliability qualification from R&D to mass production.

Faster Time-to-Market 

Flexible testing capacity and optimized ATE performance eliminate OSAT bottlenecks and accelerate product launch timelines.

Lower Cost, Higher Value

Competitive engineering and operational costs, supported by government incentives, deliver strong cost efficiency versus traditional semiconductor hubs.

High Technical Expertise

Experienced engineers across chip design and testing, with strong specialization in Power, Analog, and Sensor ICs.

Discover FAT’s Capabilities

FAT Services and Solutions

ATE Development Service

We design and develop customized Automated Test Equipment (ATE) solutions tailored to your IC specifications

  • Test plan development
  • Project management
  • Load board design
  • Product characterization
  • Change kit design
  • Test limit evaluation
  • Test program development
  • Test time optimization
  • Test program & debug device
  • Test cost reduction strategies
ATE Production Services
Reliability Qualifications and Burn-In
Failures Analysis Services

Functional Tests

1

MCU Tests

  • Program Execution (FLASH, SRAM)
  • Interrupts
  • Sleep Mode, Deep sleep mode
  • Debug port (SWD)
  • SysTick Timer
2

Memory Tests

  • SRAM tests
3

GPIO Tests

  • GPIO Output Tests
  • GPIO Input Tests
  • Interrupt Tests
  • Pull-up, pull-down tests
  • Drive strength tests
4

PWM/Timer Tests

  • GPIO Output Tests
  • GPIO Input Tests
  • Interrupt Tests
  • Pull-up, pull-down tests
  • Drive strength tests
5

ADC Tests

  • Manual Mode Tests
  • Sequencer Tests
6

UART Tests

  • UART Tests
  • Interrupt Tests
7

WDT Tests

  • Interval Tests
  • POR tests
8

SPI Tests

  • SPI Master tests
  • Interrupt tests
9

I2C Tests

  • I2C Master tests
  • Interrupt Tests
10

RTC Tests

  • RTC timer tests
  • Interrupt tests

FAT Factory
Supply Chain Journey

Transfer the wafer to the factory
Packaging factory
IC Packaging
FPT’s role
Reliability Qualifications and Burn-in Services
ATE Production Services
ATE Development Services
Shipping
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