“Despite the increased restrictions on the export of advanced chips to China, the United States expressed disinterest in expanding them further to include mature or traditional chips”
On February 22, 2024, Thea D. Rozman Kendler, the official responsible for managing the export of high-tech products from the United States, conducted an interview with Nikkei and other media outlets at the U.S. Embassy in Tokyo. During the interview, issues related to the U.S. export restrictions on China were discussed.
In the context of ongoing semiconductor trade war between the U.S. and China, and the tightening restrictions on the export of advanced chip manufacturing equipment to China, Huawei, a leading Chinese semiconductor and smartphone manufacturer, surprisingly introduced the Mate 60 smartphone, featuring the Kirin 9000S chip in late 2023. Notably, this chip is not considered a traditional chip but an upgrade from the 14nm chip, with performance equivalent to advanced 7nm chips, even without the use of EDA tools from the U.S. Many tech analysts have speculated on the U.S’s next moves, questioning whether the sanctions policy will be tightened further, extending to traditional chips, to curb China’s expanding influence in the semiconductor industry.
However, in the recent interview, Kendler once again affirmed that “the narrower, the better” regarding control measures. The U.S. will not impose tranctions on traditional chips exported to China.
Is this move a part of the U.S’s next strategy, regarding the ambition to grow the semiconductor industry of the U.S and its allies in the near future?
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